dotnet core barcode generator

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These types of products are in use throughout the industry and are tolerated as long as the numbers of HDI boards are a small percentage of the overall production. This practice, however, dramatically reduces the output of the plating line and increases the cost of the part. As the percentage of HDI boards increased, the need for a different answer became apparent. 29.5.8 Chemically Mediated Process Here, the carrier is engineered for maximum chemical suppression, even at a high-current density. This is demonstrated by the shift in the Tafel slope (see Fig. 29.11). These baths are capable of good throwing power and surface distribution while plating at relatively high-current densities. Super-throw baths are capable of 85 percent throw in a 5:1 aspect ratio board while plating at 30 and at 35 ASF. This kind of bath contrasts with the low-current bath and can improve productivity significantly, while still operating under conventional DC plating.

The system fits readily into existing in-house equipment and in-house know-how. Figure 29.12 shows an example of a blind via that is 5.0 mil in diameter and 3.0 mil deep, plated with this type of bath at 20 ASF for 90 min.

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The manufacture of surfaces that are used for ophthalmic purposes (made of glass) and for enhancing night vision (made of silicon and germanium) essentially involve precision machining processes [13] The tolerance for form is of the order of 8 m, but the surface finish for cosmetic reasons is of the order of 3 nm Precision versus ophthalmic lenses Optical surfaces are mainly required for manufacturing two categories of products, viz precision optics and ophthalmic optics The former requires the highest accuracy with regard to the contour of the optical surface (Figure 115) The requirements for the latter which concerns manufacture of spectacles are however less stringent with regard to the contour, but there is a demand for the cosmetic

Pulse Plating (Electrically Mediated Process) In this plating system, the bath is engineered to respond to a periodically pulsed reverse current. The required Tafel slope shift is accomplished through rectification (see Fig. 29.13). The rectifier produces a pulsed wave with a forward cathodic current that is perturbed by short anodic pulses. The forward current at 1X (e.g., 30 ASF) is maintained for 10 ms and the reversed at 3X (e.g., 90 ASF) for 0.5 ms, for example. The duty cycle may vary (e.g., 20 ms forward with 1.0 ms reverse).

The idea of this circuit is to provide a very simple code authentication scheme. The circuit is based on the AT90S2343 AVR controller. It has three input keys and two output LEDs for visual feedback. These LED outputs are also used to provide a Valid signal when the entered key sequence is correct. The input keys are labeled 0, 1, and New. To enter a key sequence, the New key is pressed followed by the sequence of keys for the code, 0 or 1. After each key press, the Ack LED indicates that the key press is recognized. For an error, the Ack and the OK LEDs blink alternately. If the entered key sequence is correct, both of these LEDs go ON at the same time and stay on for five seconds (Figure 20.1).

FIGURE 29.12 Example of a blind via that is 5.0 mil in diameter and 3.0 mil deep, plated with chemically mediated bath.

There is also room to optimize the forward-to-reverse current ratio; 1:3 is only one example. The shape of the wave is very important here, also. A square wave with minimum rise time gives the best results (see Fig. 29.14).

1000 500 0 -500 -1000 -1500 -2000 -2500

Fig 113:

Chemical suppliers have designed specific additive packages that ensure maximum response to the periodic pulse reverse wave. During the reverse cycle, the additive is preferentially desorbed from the high-current-density areas. This results in less plating acceleration due to the additive, and more suppression due to the carrier. Since the low-current-density areas of the panel will also receive a lower reverse pulse, the acceleration is reduced to a lesser degree than in the high-current-density areas. This leads to greatly improved plating thickness distribution.

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